This document describes guidelines for Printed Wiring Board (PWB) design and assembly of the SCA3000 Component. It aims to help customers achieve the optimum soldering process.
It should be emphasized that this document serves only as a design guideline to help develop the optimal assembly conditions. It is essential that users also use their own manufacturing practices and experience to be able to fulfill the needs of varying end-use applications.
VTI's Molded Interconnection Device Package (MID)
The housing of the SCA3000 component is relatively new packaging concept, which is called a molded interconnection device (MID), which is a modified Dual Flat-pack No-lead package (DFN). The MID housing is leadless component as well as DFN package. The SCA3000 component is a surface mount plastic package with leads located at the bottom of the package, see picture 1.
Figure 1. 3D pictures of the SCA3000 component. The SCA3000 component leads are located at the bottom of the package.
MID-technology offers a variety of benefits including reduced lead inductance, a small sized "near chip scale" footprint, thin profile, and low weight. The MID component is an injection molded plastic substrate, and the conductive circuit pattern is manufactured on its surface. The SCA3000 component housing is manufactured by the LDS (Laser Direct Structuring) MID-process. The process flow of LDS - MID package is presented in figure 2.